S2N-6FMCS-Z5-GP


 Features
Active solution for Intel® Xeon™ (Dempsey, Woodcrest,Clovertown, Wolfdale-DP,Harpertown).
 Specifications
Application System 2U+ Form Factor Active Solution
CPU Type Intel® Xeon (Dempsey, Woodcrest, Clovertown)
Supported CPU Frequency 1.6-3.0 for Woodcrest, FSB 1333/1066
2.8-3.8 for Dempsey, FSB 1066/667
Socket Type LGA 771
Heat Sink Copper & Aluminum base + Aluminum stacked fin
Cooler Dimension 98 x 74 x 65 mm
Fastener Screw + Spring
Interface Material Shin Etsu x23-7783
Fan Dimension 60 x 60 x 25 mm
Fan Speed (rpm) 7,300 rpm
Fan Airflow 50 CFM
Fan Bearing Type Dual Ball Bearing
Voltage Rating 12 V
Noise Level (dB) 16.16 ~ 47.2 dBA
Connector 4 Pins with PWM function
Mass 424 g
CEK Spring Provided by Motherboard
Quantity per Carton 12
Thermal Resistance For Dempsey: 0.305°C/W
For Woodcrest: 0.329°C/W
For Clovertown:0.278°C/W
For Wolfdale-DP: 0.331°C/W
For Harpertown: 0.271°C/W