S2H-7DGCS-A5-GP


 Features
Active solution for Intel® Xeon™ (Dempsey, Woodcrest,Clovertown, Wolfdale-DP,Harpertown)
 Specifications
Application System 2U+ Form Factor Active Solution
CPU Type Intel® Xeon™ (Dempsey, Woodcrest,Clovertown, Wolfdale-DP,Harpertown)
Socket Type LGA 771
Heat Sink Copper stacked fin
Cooler Dimension 98 × 70 × 48.5 mm
Fastener Screw + Spring
Interface Material Shin Etsu x23-7762
Fan Dimension 70 × 70 × 15 mm
Fan Speed (rpm) 5,500 rpm
Fan Airflow 23.6 CFM
Fan Bearing Type Dual Ball Bearing
Voltage Rating 12 V
Noise Level (dB) 13.8 ~ 46 dBA
Connector 4 Pins with PWM function
Mass 516 g
CEK Spring Provided by Motherboard
Quantity per Carton 12 pcs
Thermal Resistance For Dempsey:0.318°C/W
For Woodcrest: 0.353°C/W
For Clovertown:0.302°C/W
For Wolfdale-DP: 0.355°C/W
For Harpertown: 0.295°C/W