S2H-PGKES-L5-GP


 Features
Passive solution. For Intel© Xeon â„¢  (Woodcrest, Wolfdale-DP) processor in 2U rack-mounted server
 Specifications
Application System 2U+ Form Factor Passive Solution
CPU Type Intel� Xeon™ (Woodcrest, Wolfdale-DP)
Socket Type LGA 771
Heat Sink Aluminum extrusion
Cooler Dimension 89 × 79 × 51 mm
Fastener Screw + Spring
Interface Material Shin Etsu 7783
Mass 438 g
CEK Spring Provide by Motherboard
Quantity per Carton 12 pcs