Passive solution for Intel® Nehalem processor in 2U rack-mounted server

Application System	2U+ Form Factor Passive Solution
CPU Type	Intel® Nehalem
Socket Type	LGA 1366
Heat Sink	Aluminum extrusion
Cooler Dimension	89 x 89 x 63 mm
Fastener	Screw + Spring
Interface Material	Shin Etsu X23-7762
Mass	294 g
Back Plate	EP-N1366-01-GP (Optional)
Quantity per Carton	12 pcs

For detailed specifications please download our PDF Specs Sheet.
S2N-PLMES-07-GP Product sheet	Download