Vapor Chambers provide far superior thermal performance than traditional solid metal Heat spreaders at reduced weight and height. Thermal spread resistance is almost neglectable and thermal resistance is x times lower than (refer to copper, carbon nanotube compound, nano diamond compound). Vapor Chambers enable higher component heat densities and TDPs at safe operating temperatures, extending the components and products life. 

As the coolant molecules are heated they change phases. The vaporized coolant convects freely through the chamber. The Molecules then condense on cold surfaces, dissipate their heat load, and are channeled back to the coolant reservoir. Since the rate of condensation depends on the temperature delta of the coolant and the contact surface, the coolant automatically streams towards the coolest surface area. This self-organizing active molecular coolant stream within the Vapor Chamber is responsible for its superior thermal properties. As a result it provides stable and evenly spread temperatures on all of its surfaces, regardless of the location and density of the heat source below the chamber base.